Basic Info.
Model NO.
CY-3RF
Sputtering Angle Range
0 – 25° Adjustable
Sputtering Distance Range
50 – 80 mm Adjustable
Vacuum Chamber
High Purity Quartz
Sealing Flange
Dia.274mm
Rotation Speed
1-10rpm
Holder Temperature
Rt-600c
Keywords
RF Sputtering Deposition Systems
Warranty
One Year
Transport Package
Wooden Box
Specification
dia. 50mm
Trademark
CY
Origin
Zhengzhou, China
HS Code
8486202200
Production Capacity
210 Sets Per Month
Product Description
3 Heads Compact 1" RF Plasma Magnetron Sputtering Coater -
is a three head 1" RF Plasma magnetron sputtering system designed for non-metallic thin film coating, mainly for multilayer oxide thin films. It is the most cost-effective coater for researching in the new generation of oxide thin films. (DC magnetron sputtering option is available upon request.)
is a three head 1" RF Plasma magnetron sputtering system designed for non-metallic thin film coating, mainly for multilayer oxide thin films. It is the most cost-effective coater for researching in the new generation of oxide thin films. (DC magnetron sputtering option is available upon request.)
Input Power | Single phase 220 VAC, 50 / 60 Hz 1000 W (including vacuum pump and water chiller) If the voltage is 110 V, a 1500 W transformer can be ordered |
Power Source | 13.5 MHz, 100 W RF generator with manual matching is included and connected to the sputtering heads Load range: 0 - 80 oh adjustable. Tuning range: -200j - 200j adjustable Rotatable switch can activate one sputtering head at a time. Sputtering heads can be switched "in the plasma" (no breaking of vacuum and plasma during a multilayer process) Optional 300 W auto-match RF generator is available at extra cost |
Magnetron Sputtering Head | Three 1" magnetron sputtering heads with water cooling jackets are included and inserted into quartz chamber via quick clamps RF cable replacement can be purchased One manually operated shutter is built on the flange One 10 L/min digitally controlled recirculating water chiller is included for cooling sputtering heads |
Sputtering Target | Target size requirement: 1" diameter x 1/8" thickness max Sputtering distance range: 50 - 80 mm adjustable Sputtering angle range: 0 - 25° adjustable 1" diameter Cu target and Al2O3 target are included for demo testing Various oxide 1" sputtering targets are available upon request at extra cost |
Vacuum Chamber | Vacuum chamber: 256 mm OD x 238 mm ID x 276 mm Height, made of high purity quartz Sealing flange: 274 mm Dia. made of Aluminum with high temperature silicone O-ring Stainless steel shield cage is included for 100% shielding of RF radiation from the chamber Max vacuum level: 10^-4 Torr with optional turbo pump and chamber baking |
Sample Holder | Sample holder is a rotatable and heatable stage made of ceramic heater with stainless steel cover Sample holder size: 50 mm Dia. for. 2" wafer max Rotation speed: 1 - 10 rpm adjustable for uniform coating The holder temperature is adjustable from RT to 600 °C max (5 min max at 600 °C; 2 hr max at 500 °C) with accuracy +/- 1.0 °C via a digital temperature controller |
Vacuum Pump | KF40 vacuum port is built in for connecting to a vacuum pump. Vacuum level: 10^-3 Torr with included dual stage mechanical pump 10^-4 Torr with optional turbo pump |
Size | 540 mm L x 540 mm W x 1000 mm H |
Net Weight | 60 kg |
Compliance | CE approval |