3 Heads Compact RF Plasma Magnetron Sputtering Deposition System

Type: Coating Spray Gun
Coating: Vacuum Coating
Substrate: Glass
Certification: CE, TUV
Condition: New
Power Source: 100W RF

Products Details

Basic Info.

Model NO.
CY-3RF
Sputtering Angle Range
0 – 25° Adjustable 
Sputtering Distance Range
50 – 80 mm Adjustable
Vacuum Chamber
High Purity Quartz
Sealing Flange
Dia.274mm
Rotation Speed
1-10rpm
Holder Temperature
Rt-600c
Keywords
RF Sputtering Deposition Systems
Warranty
One Year
Transport Package
Wooden Box
Specification
dia. 50mm
Trademark
CY
Origin
Zhengzhou, China
HS Code
8486202200
Production Capacity
210 Sets Per Month

Product Description

3 Heads Compact 1" RF Plasma Magnetron Sputtering Coater -
 is a three head 1" RF Plasma magnetron sputtering system designed for non-metallic thin film coating, mainly for multilayer oxide thin films. It is the most cost-effective coater for researching in the new generation of oxide thin films. (DC magnetron sputtering option is available upon request.)

 
Input Power
 
Single phase 220 VAC, 50 / 60 Hz
1000 W (including vacuum pump and water chiller)
If the voltage is 110 V, a 1500 W transformer can be ordered
Power Source


  
13.5 MHz, 100 W RF generator with manual matching is included and connected to the sputtering heads
Load range: 0 - 80 oh adjustable. Tuning range: -200j - 200j adjustable
Rotatable switch can activate one sputtering head at a time. Sputtering heads can be switched "in the plasma" (no breaking of vacuum and plasma during a multilayer process)
Optional 300 W auto-match RF generator is available at extra cost
Magnetron Sputtering Head
 
Three 1" magnetron sputtering heads with water cooling jackets are included and inserted into quartz chamber via quick clamps
RF cable replacement can be purchased
One manually operated shutter is built on the flange   
One 10 L/min digitally controlled recirculating water chiller is included for cooling sputtering heads
Sputtering Target Target size requirement: 1" diameter x 1/8" thickness max
Sputtering distance range: 50 - 80 mm adjustable
Sputtering angle range: 0 - 25° adjustable 
1" diameter Cu target and Al2O3 target are included for demo testing
Various oxide 1" sputtering targets are available upon request at extra cost
Vacuum Chamber

 
Vacuum chamber:  256 mm OD x 238 mm ID x  276 mm Height, made of high purity quartz
Sealing flange: 274 mm Dia. made of Aluminum with high temperature silicone O-ring
Stainless steel shield cage is included for 100% shielding of RF radiation from the chamber
Max vacuum level: 10^-4 Torr with optional turbo pump and chamber baking 
Sample Holder

 
Sample holder is a rotatable and heatable stage made of ceramic heater with stainless steel cover
Sample holder size: 50 mm Dia. for. 2" wafer max
Rotation speed: 1 - 10 rpm adjustable for uniform coating
The holder temperature is adjustable from RT to 600 °C max (5 min max at 600 °C; 2 hr max at 500 °C) with accuracy +/- 1.0 °C via a digital temperature controller
Vacuum Pump 
 
KF40 vacuum port is built in for connecting to a vacuum pump.
Vacuum level: 10^-3 Torr with included dual stage mechanical pump
10^-4 Torr with optional turbo pump 
Size 540 mm L x 540 mm W x 1000 mm H
Net Weight 60 kg
Compliance CE approval

3 Heads Compact RF Plasma Magnetron Sputtering Deposition System
3 Heads Compact RF Plasma Magnetron Sputtering Deposition System
3 Heads Compact RF Plasma Magnetron Sputtering Deposition System
3 Heads Compact RF Plasma Magnetron Sputtering Deposition System



3 Heads Compact RF Plasma Magnetron Sputtering Deposition System



 

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