- Overview
- Product Description
- Company Information
Basic Info.
Model NO.
XK-NiV
Usage
PVD Film Coating
Shape
Rotary,Plate,Circle,Pellets
Delivery Time
7-21days
Keywords
Metal Nickel Chromium Alloy
Percent
Niv7wt%
Size
D50.8X3mm or as Request
Purity
99.9%-99.99%
Chemical Composition
Niv7wt%
Appearance
Polished Surface
MOQ
1PC
Product Name
Nickel Vanadium Alloy Rotary Target
Package
Vacuum Blister
Transport Package
Vacuum Sealed Package Inside
Trademark
XinKang
Origin
Hunan, China
Production Capacity
1000000 Piece/Pieces Per Month
Product Description
XinKang Hot Sale NiV7 Target NiV7wt% Metal Nickel Vanadium Rotary Sputtering Target for PVD Process 
| Name | Metal Nickel Vanadium Alloy Sputtering Targets |
| Purity | 99.9%-99.99% |
| Size | D50.8x3mm, D76.2x6mm,2inch,3inch, As request |
| Ni Boiling Point | 2732 |
| Ni Density | 8.9g/cm³ |
| Ni Melting Point | 1453.0 |
| Shape | Planar target, Rotary target. |
| MOQ | 1PCS |
| Application | Evaporation materials, PVD Film Coating and etc |
Preparation process of nickel-vanadium alloy sputtering target
Material Preparation - Vacuum Induction Melting - Chemical Analysis - Forging - Rolling - Annealing - Metallographic Inspection - Machining - Dimensional Inspection - Cleaning - Final Inspection - Packaging
In the fabrication of integrated circuits, pure gold is generally used as interconnect metal, deposited on a silicon wafer, but gold will diffuse into the silicon wafer to form a high-resistance AuSi compound, which will greatly reduce the current density in the wiring, resulting in the failure of entire wiring system.
So, It is proposed to add adhesive layer between the gold thin film and silicon wafers. The adhesive layer is usually made of pure nickel, but diffusion also occurs between the nickel layer and the gold conductive layer, so that a barrier layer is needed to prevent diffusion between the gold conductive layer and nickel adhesive layer.
With a high melting point and a large current density, vanadium is chosen to deposit barrier layer, therefore, nickel sputtering target, vanadium sputtering target, gold sputtering target are all used in the fabrication of integrated circuits.
Nickel vanadium NiV sputtering targets containing 7% vanadium has both advantages of nickel and vanadium, thus adhesive layer and barrier layer can be achieved at a time. NiV alloy is non-magnetic materials, which is conducive to magnetron sputtering. In the electronics information industry, it is gradually replacing pure nickel sputtering targets.
The picture below are two micrographs of our NiV(93/7 wt%) alloy sputtering target, the average grain size<100μm.
Following is a typically Certificate of analysis for 3N5 NiV 97/3wt% sputtering target.
Other Related Sputtering Targets
| Metal Target | Ni,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and rare earth targets |
| Alloy Target | Ni,Fe,Co,Cu,Al alloy. and special alloy |
| Evaporation Materials | Ni,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and etc |
| Ceramic Targets | Oxide Ceramic, Compound ceramic targets. |
1. Are you trading company or manufacturer ?
Xinkang: We are a professional manufacturer specialized in this field for over 10 years.
2: How long is your delivery time?
Xinkang: Shipment can be made in 5-7 days for those regular size, or samples , and 15-20 days for batch quantity.
3: Do you have MOQ ?
Xinkang: No, we support samples.
4: What is your payment method?
Xinkang: T/T in advance, Paypal , Western Union and etc.